Chip Integration Technology Center
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Chip Integration Technology Center
@citcnetherlands.bsky.social
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Joint innovation center | heterogeneous integration and advanced chip packaging technology | providing access to innovation, infrastructure, and education | non-profit | www.citc.org
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🧪In collaboration with Holst Centre, CITC has developed a fan-out panel level packaging (FOPLP) demo. This is a cost-effective platform for high-performance small form factor packages. The technology serves as a building block for future high-frequency packages such as automotive radar.
🧪Last week, the practical week of the Semiconductor Packaging University Program took place. Three eager students worked in our labs and learned that dies can actually fly. Their efforts were rewarded with a well-deserved certificate.
#accesstoeducation #semiconductorpackaging
🧪CITC and Neways Electronics took an important step in transforming groundbreaking research into competitive industrial solutions. We aim to validate sintering for RF demonstrators and accelerate technology readiness from lab to production. #valorization #RFtechnology #advancedpackaging #sintering
🧪We are pleased and proud to announce that CITC will become part of TNO from January 1, 2026. This strategic move marks a significant step toward ensuring the long-term continuity and stability of our research and operations. Please check out the press release: www.citc.org/citc-becomes...
🧪Happy faces after the final day of classes at this year's Semiconductor Packaging University Program. The students have completed the theoretical part. Congratulations to all - put your newly acquired knowledge to good use!
#accesstoeducation #semiconductorpackaging
🧪Last Friday, CITC was one of the exhibitors at the Innovate Experience. We had several pleasant encounters with fellow innovators, students and the general public. We loved explaining our work to them. #accesstoeducation #accesstoinnovation
🧪One of our Noviotech Campus partners wanted to know if we could facilitate a two-day internship for a 14-year-old STEM student... Of course we could! We created a customized 'introduction to chip packaging' program, including the making of the one and only CITC key chain. #accesstoeducation
🧪On Oct 10, CITC will participate in the Innovate Experience for the first time. We're looking forward to meeting the most innovative students in the Netherlands and presenting our latest developments to the innovation-minded people in the Lifeport@ region. Location: Parkzaal, Musis Arnhem.
🧪A well-attended Nijmegen Technology Day. Over 100 children gazed in amazement at the tiny chip under the microscope, tried to guess the number of chip packages in the jar, and got to work on the 'make-your-own-microchip-out-of-paper' project. Perhaps, a little 'STEM seed' has been planted...
🧪On Wednesday, we had the pleasure of hosting a delegation from the Ministry of Economic Affairs. Our group manager, Francesca Chiappini, welcomed them with a comprehensive presentation about our activities and ambitions, followed by a short lab tour. #accesstoinnovation
🧪 Always a memorable moment: the kick-off of our Semiconductor Packaging University Program. The first lecturer of the series, as always, is Henk van Zeijl from Delft University of Technology. He will introduce the partipants to the world of semiconductor front-end technologies.
#accesstoeducation
🧪 Yesterday, a group of CEOs active in the photonics industry visited our labs. Our program manager Sander Dorrestein informed them about our activities in integrated photonics packaging and our roadmap for future development topics.
#integratedphotonics #collaboration #accesstoinnovation
🧪 Job alert: Business Development Manager at CITC in Nijmegen (NL). If you know how to identify market challenges and translate in-depth technology and market know-how into R&D projects and how to build strong, long-term partnerships, please apply via the link below.
www.tno.nl/en/careers/v...
Vacancy Business Development Manager Advanced Chip Packaging | Nijmegen at TNO in Eindhoven
Want to make your mark on the future of Advanced Chip Packaging? Become a Business Development Manager with TNO at CITC in Nijmegen!
www.tno.nl
🧪 Look who's back! One of our wirebonders has been gone for a while because we ran out of space. After renovations in our labs and rearranging the equipment, there is now room for it. Once the wirebonder is installed, we'll put it to good use. #accesstoinfrastructure #returnofthewirebonder
🧪 Today is Alex Harper's last day at CITC. Last week, he successfully presented and defended his work at the HAN University of Applied Sciences. His work on the new design of a slit nozzle was graded with a 7. Congratulations Alex on this achievement!
#accesstoeducation #semiconductorpackaging
🧪 There are still a few hours left at the innovation market at Holst Centre Innovation Day 2025, so you can still check out CITC's latest developments in integrated photonics, fan-out panel level packaging and additive fan-out packaging.
#accesstoinnovation
🧪 CITC's Noud Schoenmakers was one of the presenters at the Mechanical Engineering (ME) Innovation Day at Eindhoven University of Technology. He talked about his PhD work on understanding the micromechanics and reliability of lead-free interconnects designed for power packaging. #micromechanics
🧪 What a great day we had when we visited the students of Mondial College! They presented the most amazing projectand it was clear that they learned a lot about chips and their packaging, but also about binary codes, programming, laser work and so on. This is what #STEM education is all about!
🧪 On Friday, CITC will judge the chip exhibits made by the students of Mondial College. The jury is looking forward to judging the final designs. Meanwhile, the prizes for the best exhibits are waiting to be awarded: a box of packaged chips... of course.
🧪Today, the registration for the CITC Semiconductor Packaging University Program 2025 begins. This program is accessible to professionals interested in the semiconductor industry, who are keen to expand their knowledge of semiconductor assembly and packaging. More info: www.citc.org/program-line...
Semiconductor Packaging University Program - CITC
HAN and CITC offer a Semiconductor Packaging University Program. A minor for students and a course for professionals. Read more.
www.citc.org
🧪 Our colleague Noud Schoenmakers gave a course in thermal mechanical skills at the Eindhoven University of Technology. The students were very enthusiastic. Hopefully, we will meet some of them again - as a future intern, PhD candidate or colleague.
🧪 A warm welcome to Zihan Zhang! For the next 3 months, he will be conducting experiments on microfluidic cooling at CITC together with Henry Antony Martin. Zihan is a PhD candidate of Delft University of Technology. His research focuses on thermal management of high-power electronic devices.
🧪All set to start work on a large data study about novel die attach materials. Our team is going to test these first packages with additive enhanced sintered silver. #madeinhouse #workinprogress
🧪A busy day at the Fontys Engineers Meet & Match for team CITC. As always, we seize the opportunity to meet future interns/colleagues. We talked to over 50 enthusiastic students in mechanical engineering, mechatronics and electrical engineering. We look forward to receiving their applications!
🧪 Team CITC was present at the well-attended TNO #Semicon Event with a small booth. Mark Luke Farrugia was also one of the speakers in the conference program. He informed the audience about our latest developments in competitive sustainable advanced packaging (CSAP) and photonics.