Author | Lightnews

Chip Integration Technology Center @citcnetherlands.bsky.social · 17h

🧪In collaboration with Holst Centre, CITC has developed a fan-out panel level packaging (FOPLP) demo. This is a cost-effective platform for high-performance small form factor packages. The technology serves as a building block for future high-frequency packages such as automotive radar.

A close-up of a fan-out panel level package (FOPLP). This is a cost-effective platform for high-performance small form factor packages. The panel in the picture measures 320 x 350 mm. The technology forms the basis for further development and prototyping, as it serves as a building block for future high-frequency packages such as automotive radar.

Chip Integration Technology Center @citcnetherlands.bsky.social · 2d

🧪Last week, the practical week of the Semiconductor Packaging University Program took place. Three eager students worked in our labs and learned that dies can actually fly. Their efforts were rewarded with a well-deserved certificate.
#accesstoeducation #semiconductorpackaging

Three young men standing in front of a screen showing 'CITC Semiconductor Packaging University Program'. In the middle the course coordinator with a thumbs up for his two students who have a certificate.

Chip Integration Technology Center @citcnetherlands.bsky.social · 16d

🧪CITC and Neways Electronics took an important step in transforming groundbreaking research into competitive industrial solutions. We aim to validate sintering for RF demonstrators and accelerate technology readiness from lab to production. #valorization #RFtechnology #advancedpackaging #sintering

Seven men standing and sitting in front of a screen that shows: Polaris/Neways/CITC sinter workshop. They just attended said workshop and are smiling.

Chip Integration Technology Center @citcnetherlands.bsky.social · 17d

🧪We are pleased and proud to announce that CITC will become part of TNO from January 1, 2026. This strategic move marks a significant step toward ensuring the long-term continuity and stability of our research and operations. Please check out the press release: www.citc.org/citc-becomes...

Gloved hand holding a demo of a chip packaging fan-out panel.

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Chip Integration Technology Center @citcnetherlands.bsky.social · 22d

🧪Happy faces after the final day of classes at this year's Semiconductor Packaging University Program. The students have completed the theoretical part. Congratulations to all - put your newly acquired knowledge to good use!
#accesstoeducation #semiconductorpackaging

Happy students with a certificate in their hands. They just finished the theoretical part of the CITC Semiconductor Packaging University Program.

Chip Integration Technology Center @citcnetherlands.bsky.social · 24d

🧪Last Friday, CITC was one of the exhibitors at the Innovate Experience. We had several pleasant encounters with fellow innovators, students and the general public. We loved explaining our work to them. #accesstoeducation #accesstoinnovation

Young researcher at exhibition showing the latest developments in chip packaging. On the left a display tower with chip packaging samples, in the middle a photonic packaging demonstrator with light and on the right a small microscope with a tablet showing a chip packaging sample.

Chip Integration Technology Center @citcnetherlands.bsky.social · 28d

🧪One of our Noviotech Campus partners wanted to know if we could facilitate a two-day internship for a 14-year-old STEM student... Of course we could! We created a customized 'introduction to chip packaging' program, including the making of the one and only CITC key chain. #accesstoeducation

A box of chocolates with a kind 'Thank you' note from a student. Below the box sits a CITC key chain which includes a small chip.

Chip Integration Technology Center @citcnetherlands.bsky.social · Oct 6

🧪On Oct 10, CITC will participate in the Innovate Experience for the first time. We're looking forward to meeting the most innovative students in the Netherlands and presenting our latest developments to the innovation-minded people in the Lifeport@ region. Location: Parkzaal, Musis Arnhem.

Announcement of Innovate Experience, an event that showcases innovation and novelties.

Chip Integration Technology Center @citcnetherlands.bsky.social · Sep 23

🧪A well-attended Nijmegen Technology Day. Over 100 children gazed in amazement at the tiny chip under the microscope, tried to guess the number of chip packages in the jar, and got to work on the 'make-your-own-microchip-out-of-paper' project. Perhaps, a little 'STEM seed' has been planted...

Several adults and children visiting an event to enthuse young children for technology. On the left of the picture, there is a banner which states (in Dutch) 'Working together on new chip technology'. On the right children are working on a craft project.

Chip Integration Technology Center @citcnetherlands.bsky.social · Sep 12

🧪On Wednesday, we had the pleasure of hosting a delegation from the Ministry of Economic Affairs. Our group manager, Francesca Chiappini, welcomed them with a comprehensive presentation about our activities and ambitions, followed by a short lab tour. #accesstoinnovation

Young woman standing in front of a group, giving a presentation. On the table next to her a collection of scientific samples of microchips.

Chip Integration Technology Center @citcnetherlands.bsky.social · Sep 2

🧪 Always a memorable moment: the kick-off of our Semiconductor Packaging University Program. The first lecturer of the series, as always, is Henk van Zeijl from Delft University of Technology. He will introduce the partipants to the world of semiconductor front-end technologies.
#accesstoeducation

Lecturer standing in front of a classroom explaining the basics of semiconductor front-end technologies. The students sit in a U-shape and are listening attentively.

Chip Integration Technology Center @citcnetherlands.bsky.social · Aug 29

🧪 Yesterday, a group of CEOs active in the photonics industry visited our labs. Our program manager Sander Dorrestein informed them about our activities in integrated photonics packaging and our roadmap for future development topics.
#integratedphotonics #collaboration #accesstoinnovation

Research scientist presenting a scale model of a photonics packaging device in front of a classroom.

Chip Integration Technology Center @citcnetherlands.bsky.social · Aug 27

🧪 Job alert: Business Development Manager at CITC in Nijmegen (NL). If you know how to identify market challenges and translate in-depth technology and market know-how into R&D projects and how to build strong, long-term partnerships, please apply via the link below.
www.tno.nl/en/careers/v...

Vacancy Business Development Manager Advanced Chip Packaging | Nijmegen at TNO in Eindhoven

Want to make your mark on the future of Advanced Chip Packaging? Become a Business Development Manager with TNO at CITC in Nijmegen!

www.tno.nl

Chip Integration Technology Center @citcnetherlands.bsky.social · Aug 26

🧪 Look who's back! One of our wirebonders has been gone for a while because we ran out of space. After renovations in our labs and rearranging the equipment, there is now room for it. Once the wirebonder is installed, we'll put it to good use. #accesstoinfrastructure #returnofthewirebonder

Piece of equipment (a wirebonder used for the packaging op microchips) stands wrapped in a corner of a laboratory. It is connected to power and about to be put into use.

Chip Integration Technology Center @citcnetherlands.bsky.social · Jun 27

🧪 Today is Alex Harper's last day at CITC. Last week, he successfully presented and defended his work at the HAN University of Applied Sciences. His work on the new design of a slit nozzle was graded with a 7. Congratulations Alex on this achievement!
#accesstoeducation #semiconductorpackaging

Young male student standing in front of a video screen while presenting his final project. The project concerned a new design for a slit nozzle which is used in semiconductor packaging.

Chip Integration Technology Center @citcnetherlands.bsky.social · Jun 25

🧪 There are still a few hours left at the innovation market at Holst Centre Innovation Day 2025, so you can still check out CITC's latest developments in integrated photonics, fan-out panel level packaging and additive fan-out packaging.
#accesstoinnovation

Two female scientists and one male scientist are standing behind a table with all kind of semiconductor and photonics packaging demos. There is a video screen behind them explaining some of the demos. Most important one is on the left: a big glass plate with additive fan-out packaging on it.

Chip Integration Technology Center @citcnetherlands.bsky.social · Jun 24

🧪 CITC's Noud Schoenmakers was one of the presenters at the Mechanical Engineering (ME) Innovation Day at Eindhoven University of Technology. He talked about his PhD work on understanding the micromechanics and reliability of lead-free interconnects designed for power packaging. #micromechanics

CITC's PhD candidate Noud Schoenmakers is presenting his work at the Mechanical Engineering Innovation Day at Eindhoven University of Technology. Noud talked about his PhD work on understanding the micromechanics and reliability of lead-free interconnects designed for power packaging.

Chip Integration Technology Center @citcnetherlands.bsky.social · Jun 17

🧪 What a great day we had when we visited the students of Mondial College! They presented the most amazing projectand it was clear that they learned a lot about chips and their packaging, but also about binary codes, programming, laser work and so on. This is what #STEM education is all about!

A box with four sides open, displaying different games related to microchip design and packaging. Students from a Dutch secondary school developed the box as an assignment within their Technasium (STEM) program.

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Chip Integration Technology Center @citcnetherlands.bsky.social · Jun 11

🧪 On Friday, CITC will judge the chip exhibits made by the students of Mondial College. The jury is looking forward to judging the final designs. Meanwhile, the prizes for the best exhibits are waiting to be awarded: a box of packaged chips... of course.

A tower of Pringles cans with labels on it stating they are the first prize in the chip exhibit design competition at Mondial College, Nijmegen, the Netherlands. CITC will assess the exhibits and award the prizes.

Chip Integration Technology Center @citcnetherlands.bsky.social · May 27

🧪Today, the registration for the CITC Semiconductor Packaging University Program 2025 begins. This program is accessible to professionals interested in the semiconductor industry, who are keen to expand their knowledge of semiconductor assembly and packaging. More info: www.citc.org/program-line...

Semiconductor Packaging University Program - CITC

HAN and CITC offer a Semiconductor Packaging University Program. A minor for students and a course for professionals. Read more.

www.citc.org

Chip Integration Technology Center @citcnetherlands.bsky.social · May 23

🧪 Our colleague Noud Schoenmakers gave a course in thermal mechanical skills at the Eindhoven University of Technology. The students were very enthusiastic. Hopefully, we will meet some of them again - as a future intern, PhD candidate or colleague.

Young male PhD candidate holding a sample of a chip package while teaching a workshop about thermal mechanical skills at Eindhoven University of Technology. He is standing in a materials lab, surrounded by listening students.

Chip Integration Technology Center @citcnetherlands.bsky.social · May 13

🧪 A warm welcome to Zihan Zhang! For the next 3 months, he will be conducting experiments on microfluidic cooling at CITC together with Henry Antony Martin. Zihan is a PhD candidate of Delft University of Technology. His research focuses on thermal management of high-power electronic devices.

Two young researchers stand next to a computerscreen showing a chip package that they are working on.

Chip Integration Technology Center @citcnetherlands.bsky.social · May 8

🧪All set to start work on a large data study about novel die attach materials. Our team is going to test these first packages with additive enhanced sintered silver. #madeinhouse #workinprogress

Set of semiconductor packaging samples waiting to be processed by a researcher. Photo taken in the lab of Chip Integration Technology Center in the Netherlands.

Chip Integration Technology Center @citcnetherlands.bsky.social · Apr 9

🧪A busy day at the Fontys Engineers Meet & Match for team CITC. As always, we seize the opportunity to meet future interns/colleagues. We talked to over 50 enthusiastic students in mechanical engineering, mechatronics and electrical engineering. We look forward to receiving their applications!

Young researcher getting ready for speed dating sessions with technical students at a career fair in the Netherlands.

Chip Integration Technology Center @citcnetherlands.bsky.social · Apr 4

🧪 Team CITC was present at the well-attended TNO #Semicon Event with a small booth. Mark Luke Farrugia was also one of the speakers in the conference program. He informed the audience about our latest developments in competitive sustainable advanced packaging (CSAP) and photonics.