Day 2, 23:00 In hall 1!
Day 2, 23:00 In hall 1!
Also come see our talk on Day 2 23:00 in Room 1: "Xous: A Pure-Rust Rethink of the Embedded Operating System", where bunnie & xobs will co-present on Xous running on Baochip!
Also come see our talk on Day 2 23:00 in Room 1: "Xous: A Pure-Rust Rethink of the Embedded Operating System", where bunnie & xobs will co-present on Xous running on Baochip!
If you're interested in one and will be at #39C3, come find @bunnie.org at the fail0verflow assembly. He'll have a limited number of Alpha-1 release boards to give away!
Source at github.com/baochip/dabao
If you're interested in one and will be at #39C3, come find @bunnie.org at the fail0verflow assembly. He'll have a limited number of Alpha-1 release boards to give away!
Source at github.com/baochip/dabao
Here's a link that should have no expiration! discord.gg/yesbcPF9Xy
Here's a link that should have no expiration! discord.gg/yesbcPF9Xy
Pictured is a simulation of AES chaffing, where fake and real data are computed in a random order. The timing of fake->real and real->fake has to be identical in order to mask power side channels.
Pictured is a simulation of AES chaffing, where fake and real data are computed in a random order. The timing of fake->real and real->fake has to be identical in order to mask power side channels.
discord.gg/5SgHvcNB
It's early days and we're still figuring out how to configure things, so thanks for your patience as we iron out the wrinkles!
discord.gg/5SgHvcNB
It's early days and we're still figuring out how to configure things, so thanks for your patience as we iron out the wrinkles!
The Baochip-1x is packaged specifically to enable you to verify that you've got the correct chip, and not a fake or a substitute part (see bunnie.org/iris for how).
The final chip will have part numbering that overlaps the memory array on the lower third of the chip.
The Baochip-1x is packaged specifically to enable you to verify that you've got the correct chip, and not a fake or a substitute part (see bunnie.org/iris for how).
The final chip will have part numbering that overlaps the memory array on the lower third of the chip.
12" wafer of CSP bumped chips, hot off the line (solder balls are face-up in this photo, with a couple die already removed for testing).
12" wafer of CSP bumped chips, hot off the line (solder balls are face-up in this photo, with a couple die already removed for testing).
Learn more on how to simulate the Baochip-1x here: baochip.github.io/baochip-1x/c...
Learn more on how to simulate the Baochip-1x here: baochip.github.io/baochip-1x/c...