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aschilling.bsky.social
A. Schilling
@aschilling.bsky.social
630 followers 58 following 390 posts
Editor at hardwareluxx.de
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 10h
OpenAI and Tachyum announce strategic partnership to deploy 10 Quadrillion Watts of Compute Power without deploying any actual Chip made by Tachyum.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 14h
TSMC Revenue by Node as of Q3 2025.

We should see N2 emerging by Q1 2026 in this graph.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 1d
Apple M5

- 4x Performance Core
- 6x Efficiency Core
- +15% nT Performance
- +45% higher GPU Performance
- 153 GB/s Memory Interface
- 3 nm Process
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 2d
www.hardwareluxx.de/index.php/ne...
Crescent Island: Neue Data Center GPU auf Basis von Xe3P mit 160 GB LPDDR5X von Intel - Hardwareluxx
Crescent Island: Neue Data Center GPU auf Basis von Xe3P mit 160 GB LPDDR5X von Intel.
www.hardwareluxx.de
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 2d
Intel just announced Crescent Island. Crescent Island is a new Intel Data Center GPU offering that will arrive in the second half of 2026. Knows features:

- air-cooled
- Xe3P microarchitecture
- 160 GB of LPDDR5X

Looks like a competitor to Rubin CPX and token optimized XPUs.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 2d
At 2025 OCP Global Summit AMD shows their Helios rack-scale solution. These are liquid-cooled, 72-GPU racks powering AMD Instinct MI450 Series GPUs, AMD EPYC CPUs (Venice) and do feature integrated UALoE scale-up connectivity.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 3d
www.hardwareluxx.de/index.php/ne...
Sprühkühlung: Kann versprühte Zweiphasen-Flüssigkeit eine CPU kühlen? - Hardwareluxx
Sprüh-Kühlung: Kann versprühte Zweiphasen-Flüssigkeit eine CPU kühlen?
https://www.hardwareluxx.de/index.php/news/hardware/kuehlung/67265-sprüh-kühlung-kann-versprühte-zweiphasen-flüssigkeit-eine-cpu-kühlen.html
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 3d
Interesting project by der8auer: Spray cooling with Novec 7000. Acceptable idle temperatures, nothing more. Just a POC.

But, spray cooling was used with the Cray X1 supercomputer. Small holes in the heatspreader sprayed directly onto the small chips, and the gas was returned.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 3d
openai.com/index/openai...
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 3d
It's official! OpenAI and Broadcom announce strategic collaboration to deploy 10 GW of OpenAI-designed AI accelerators.

OpenAI and Broadcom have signed a term sheet to deploy racks incorporating the AI accelerators and Broadcom networking solutions.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 5d
One of the slides that shows the potential of #PantherLake the best. 4P+8E+4LPE cores on par with 4P+4LPE (Lunar Lake) and better than 6P+8E+2LPE (Arrow Lake-H), where the allocation of those LPE cores had it’s hurdles.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 6d
Robinson Lake reference design for embedded/robotics #PantherLake solutions. The CPU is rated for an extended temperature range of -40 °C to 105 °C. The memory chips are labeled with 4ZC42 DBFVB from Micron. #IntelTechTour
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 7d
This is a #Intel18A wafer with #PantherLake compute tiles.

I did a quick annotation (see 2nd picture attached).
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 7d
I had the opportunity to visit Intel's #Fab52 at the Ocotillo campus in Chandler, Arizona. This is where Intel manufactures its chips in #Intel18A. In this report, I attempt to convey the enormous dimensions and challenges involved. #IntelTechTour

www.hardwareluxx.de/index.php/ne...
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 7d
A switch from #Crestmont to #Darkmont and thus a significant leap in CPU performance, but still platform-compatible and technically impressive with #Intel18A + #FoverosDirect3D. Intel provides further details on #ClearwaterForest, also known as #Xeon6+.

www.hardwareluxx.de/index.php/ne...
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 7d
Based on todays details about #PantherLake and #ClearwaterForest, we took another look at the details of #Intel18A, #PowerVia (including Omni MIM), #RibbonFET, and #Foveros. #IntelTechTour

www.hardwareluxx.de/index.php/ne...
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 7d
New (revised) E- and P-Cores, a new Xe3 GPU, significantly more efficient NPU 5 and #PantherLake in three chip configurations with a mix and match of #Intel18, #Intel3 and TSMC N6 and N3E — today we take a look at the details of Intel's upcoming CPU gen.

www.hardwareluxx.de/index.php/ar...
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 8d
300 mm GaN-on-Si wafer from Aixtron as presented by imec
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 9d
According to Prashanth Aprameyan, GM for Intel 18A & Intel 3 at Intel Foundry Services, Intel 18A-P will enter HVM by the end of 2026. This is following what Intels own roadmaps are showing.

My question is: Which product(s) will use Intel 18A-P?
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 9d
With Intel 18A the company will use Omni MIM capacitor on the backside of the BSPDN with a capacitive density of 397 fF/µm², while current designs can go up to 376 fF/µm² (on Intel 4) depending on wether this is multi-plate or single-plate design.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 9d
Qualcomm to acquire Arduino – Accelerating Developers’ Access to its Leading Edge Computing and AI

www.qualcomm.com/news/release...
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 16d
Just visited Intel Fab 42 and Fab 52 on Ocotillo campus in Arizona, where Intel will manufacture Intel 18A for Panther Lake and Clearwater Forest. #IntelTechTour
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 20d
Did some pixel counting: Based on the known dimension for the LPDDR5X packages, the Snapdragon X2 Elite Extreme is about 13.9 × 20.7 mm.
aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 20d
Qualcomm uses the N3 node by TSMC for the Snapdragon X2 Elite Extreme. But it's utilizing TSMCs FinFlex, so primarily N3P and for some parts N3X – for the Prime Cores for example. So Qualcomm gets the trade off between efficiency and performance for their monolithic design.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 20d
Qualcomm uses the N3 node by TSMC for the Snapdragon X2 Elite Extreme. But it's utilizing TSMCs FinFlex, so primarily N3P and for some parts N3X – for the Prime Cores for example. So Qualcomm gets the trade off between efficiency and performance for their monolithic design.
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aschilling.bsky.social
A. Schilling @aschilling.bsky.social · 21d
Wafer based on #imec 300 mm spin qubit platform used by #Diraq.
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